TUM Asia offers a limited number of bond free scholarships to students. These scholarships will offer subsidies in tuition fees ranging from 10%-30% subsidies.
Eligibility Criteria (for selection):
Open to both international students and Singapore citizens/PRs applying to our Master of Science degree programmes. The limited number of TUM Asia bond free scholarships will be awarded based on the following:
- Excellent academic results
- Good industrial backgrounds (if any)
- Strong recommendations/testimonials
*To qualify for consideration in this Scholarship for Master of Science programmes, applicants will be required to submit their Admissions application via the Admissions portal between 1 October and 31 March. Applications submitted after the stated deadline may not qualify.
Selection and Application Process:
Applicants do not need to apply for this scholarship separately. Students who have submitted complete applications (complete refers to submitted online application + application fee + hardcopy documents) will be automatically considered for the TUM Asia bond free scholarships upon meeting all academic and admission requirements of the respective Master Programme.
The numbers of these bond free scholarships vary yearly. Successful applicant(s) will be informed accordingly by the Office of Admission between the months of March to May.
For more information click “LINK TO ORIGINAL” below.